What We Do
RedRidge is set up for end to end product development, with in house capabilities to carry a new product from an initial concept through the entire pipeline of: requirements definition, technical architecture, electrical engineering design, mechanical engineering design, initial rapid prototypes, regulatory testing, iterative product prototypes, and setting up mass manufacturing.
We’re also happy to engage with designs which are already in development, and can help augment existing teams in any of those particular areas. Often clients will just need electrical engineering design work to prototype and mature their PCB’s, or they may already have custom electronics developed and just need firmware development work, etc. Redridge also does a wide variety of looser technical consulting projects, such as reverse engineering, competitor cost analysis, assistance with early stage grant work (SBIR, etc.), component shortage BoM updates, 3rd party design reviews, and assistance with modifying designs to pass specific troublesome regulatory tests (FCC, Cellular PTCRB Certification, Hazardous Location & Functional Safety Certification, and others).
Below is an overview of notable technologies and design areas we deal with routinely, but it’s by no means exhaustive. Given the wide range of industries we serve, from consumer electronics to medical and aerospace, this list would grow every few months. If you have a specific technical need that you don’t see listed here – get in touch, we’d love to discuss your project and see if we’d be a good fit. We do proposals and quotes at no cost to the customer.
Core Technologies
Analog Circuit Design
- Highspeed ADC & DAC Implementations
- Direct-RF Sampling Architectures
- Experience with Simultaneous Tx/Rx Front Ends up to 2Gbps
- Up/down Converting Mixers & IF Signal Processing
- Analog Signal Processing & General Purpose Op-Amp Circuits
- Analog Filter Design
- High-Order Lumped Element Filters
- Statistical tolerance analysis & monte-carlo simulation of filter response variance in production
- Absorptive Filter Design
- Distributed Microstrip Filter Design
- Audio Amplifier Design
- Ultrasonic & Piezoelectric Drive Amplifier Design
- Including amps for other capacitive transducers, hydrophones, etc.
- Electro-optical Interface Design
- Transimpedance Amplifiers
- Laser & Pump Diode Drivers
Firmware Development
- Deep experience in embedded C & C++
- Deep experience in embedded Linux
- Implementation of Linux Kernel Chip Support (CSP) Layers
- Linux Kernel Modules (LKM) and Custom Driver Development
- Device Tree and Board Support (BSP) layer development
- TI Sitara SoC (OMAP/DRAxx) Kernel & Application Development
- NXP i.MX SoC Development
- Realtime Operating System (RTOS)
- Amazon FreeRTOS
- SiLabs Micrium RTOS
- Texas Instruments TIRTOS
- Experienced in porting bare-metal projects which have reached the limit of manageable concurrency to RTOS
- Embedded Graphics & UI Development
- STMicro TouchGFX
- Segger emWin
- Microchip MPLAB Harmony
- QT GUI Applications on Embedded Linux Platforms
- MQTT & IoT Messaging Clients
- Bluetooth Mesh, Bluetooth Low Energy (BLE), ZigBee, WiSUN, and other IoT & Mesh Radio Firmware
- Realtime & Safety Critical Firmware Development
- MISRA & AUTOSAR C/C++
- Medical Device Firmware
- Aerospace Flight Firmware
- Automotive Control Unit Firmware
- Security Critical Firmware Hardening
- Secure OTA Bootloading
- Signed Image & Factory Load Security
- Fault Injection & Side Channel Attack Countermeasures
- Experience with Credit Card Embedded Controller Firmware
- Experience with Banking Grade Hardware Security Modules
- Specific Experience & Procedures for Migrating Arduino and Raspberry Pi Prototypes to Industrial Grade Platforms
High-Speed Digital Design
- Microcontroller Hardware Development
- ARM Cortex M0-M7 & Newer TrustZone enabled ARM cores
- Analogous MIPS cores
- Application Class Processor (MPU) Hardware Development
- ARM A7, A8, A15 and newer CPU’s
- Single Board Computer Design w/ TI’s Sitara & NXP’s i.MX8 MPUs
- High-Speed Memory Interface Design
- DDR3 and LPDDR4 SDRAM Implementations
- SRAM Interfaces
- SD Card & eMMC Interfaces (Quad & Octal SPI)
- FPGA Hardware Development
- Experience with Rad-Hard and Flight Rated Hardware Development
- USB 2.0, USB 3.0, & Gigabit Ethernet Hardware, Including Switches/Hubs
- PCIe Hardware
- Video and Display Hardware
- Parallel RGB TFT Interfaces
- MIPI-DSI
- EMI & EMC Mitigation for Touch Screen Interfaces
- Implementation of FPGA & ASIC Based Display Bridges
- Inline Translation Between MIPI DSI and legacy parallel RBG Video
- Motherboard Development for Modern SoM’s such as Xilinx Kria and NVIDIA Jetson/Xavier
Power Electronics
- High Performance Switchmode Converter Design
- Ultra Low Noise Converter Design for RF Supply Pre-Regulation
- Slew rate controlled switching
- Medical 60601 dual MOPP supplies
- Automotive/Aerospace Load Dump Protection
- Hotswap Control
- High Bandgap Semiconductor Converters (GaN & SiC)
- EMI/EMC Converter Debugging
- Input Filter Design
- High Frequency Converters for Micro Form Factors
- Battery Systems
- Multi-Chemistry Charge Controllers
- Battery Protection Systems
- Fuel Gauge & SoC/SoH Monitoring
- Solar Power & MPPT Converters
Design for Manufacturing
- Experience transitioning existing early-stage prototypes to cost optimized integrated PCBAs
- Design for Test
- Development and Construction of Production Test Fixtures
- In Circuit Test (ICT) and Functional Test
- Automated Test Firmware & Scripting
- Cost and Bill of Materials Optimization
- Design for Assembly-Labor Optimization
- PCB Panelization
- Wiring Harness Design & Volume Sourcing
- Experience Scaling Production Volumes
- Contract Manufacturer Selection
- We have existing relationships with multiple domestic and over seas CM’s
- Experience sourcing PCBA’s, Injection Molded Plastics, as well as Machine, Stamped, and Cut Parts at Production Quantities
PCB Layout
- Altium Designer
- KiCAD EDA
- 16+ Layer Board Design
- High Density Interconnect (HDI) Board Design
- Blind/Buried Vias
- Laser Driller Microvias
- Flex PCB Design
- High Power & High Voltage Board layout
- HV Creepage Requirements
- HV Isolation Routing
- Integrated Flex/Rigid Multi-Board Assemblies
- Complete PCBA 3D modeling
- Concurrent Multi-Board 3D modeling for low-clearance daughter board mating
- FPGA Mezzanine Cards
- M.2 / NGFF Solid State Drives
- SDRAM SODIMM Cards
- High Frequency PCB Design
- RF & Microwave distributed structures (couplers, filters, matching networks, etc.)
- Waveguide transition design
- High-frequency edge-launch to planar waveguide transitions
- Microstrip to stripline transitions
- High-frequency through board microstrip-to-microstrip transitions
- Defected ground structures & board level electromagnetic bandgap techniques
- High performance laminates
- Highspeed Digital Interface Layout
- Controlled impedance
- Skew / Group-Delay Tuning
- Highspeed Differential Routing
- Crosstalk Mitigation
- DDR3 & DDR4/LPDDR4 SDRAM Interfaces, PCIe, USB 3.0, Display Port, MIPI-CSI & MIPI-DSI
Mechanical Design
- Electronics Enclosure Design
- Injection Molded Clamshell Design
- Design for injection-molding optimization
- Rubber over-molding & tactile grips
- Sheetmetal Chassis Design
- EMI Gasketing
- Enclosure-Level Earthing
- Design and Prototyping of Machined Components
- Heat Spreaders
- Milled Cavity Microwave Enclosures
- Design & Simulation for Cavity Resonance Mitigation
- Cavity & Free-Space Feedback & Crosstalk Mitigation
- High Power Amplifier Enclosures
- Industrial & High-Reliability Electronics Chassis
- Inhouse Quickturn 3D Printing
- Electronics Test Fixture Design
- Spring pin interfaces
- Automated loading